The winners of the awards for the 26th China International Industry Fair (CIIF) were announced recently. Xiamen Hengkun New Materials Technology Co., Ltd. won the **CIIF IC Exhibition Innovation Achievement Award** for its high-temperature carbon film coating (SOC) product for integrated circuits.

This award recognizes innovative achievements in the integrated circuit sector and adopts rigorous evaluation criteria. Receiving the CIIF IC Exhibition Innovation Achievement Award is not only recognition of Hengkun New Materials’ R&D capabilities and product value, but also an encouragement for the company to uphold independent innovation and delve deep into the field of integrated circuit materials. The honor represents affirmation, and more importantly, motivation to forge ahead.

Going forward, Hengkun New Materials will continue to boost investment in R&D and innovation, uphold strict quality standards, deepen industrial chain collaboration, make constant breakthroughs in semiconductor material technologies, and contribute to the high-quality development of China’s integrated circuit industry.

We appreciate the recognition from the Organizing Committee of China International Industry Fair, as well as the support from all partners and customers. Hengkun New Materials will keep moving forward.